Spectroscopic Characterization of the Cured State of Acetylene-Terminated Resin

Abstract

The acetylene-terminated resin, bis 4-(3-ethynylphenoxy)phenyl sulfone (AT) hs ben studied using Fourier transform infrared spectroscopy (FT- IR) and high resolution nuclear magnetic resonance spectroscopy of solids. Samples which were cured at different temperatures for various times were analyzed by FT-IR and the results interpreted using factor analysis. The analysis revealed that only two major components were involved in the curing mechanism, that is, only a single polymerization reaction occurred at low curing temperatures. The pure component spectra generated by the factor analysis procedure could be used to analyze the state of cure of the resin. The infrared spectrum of the polymer is consistent with a polydiene structure. The NMR results produced a similar structural result. The extent of cure of the AT resin as evidence by the disappearance of the acetylene carbon followed a similar path to the infrared results. Curve studies also focussed on the effect of high temperature post cures of the ATS resin. Structural changes were reflected by spectroscopic differences but the changes were small and precise assignments were not possible. Further model compound studies would allow a precise determination of the structural basis of these spectroscopic differences.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1983
Accession Number
ADA133050

Entities

People

  • Jack L. Koenig

Organizations

  • Case Western Reserve University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Abstracts
  • Aeronautical Laboratories
  • Air Force
  • Air Force Facilities
  • Alkenes
  • Chemical Shifts
  • Cross Polarization
  • High Temperature
  • Infrared Spectra
  • Infrared Spectroscopy
  • Magnetic Resonance
  • Materials
  • Materials Laboratories
  • Nuclear Magnetic Resonance
  • Resins
  • Spectra
  • Spectroscopy

Fields of Study

  • Materials science

Readers

  • Image Processing and Computer Vision.
  • Materials Science and Engineering.
  • Polymer Science and Engineering.