Laser Photodeposition and Photoetching Study.
Abstract
Work during this quarter has developed a new technique for direct-write etching of Al and Al:Si:Cu alloys, and has applied this new process to correction of bridging faults in VLSI signal-processing circuits. Additional work has expanded upon two excimer-laser resist processes to develop fast deep-UV lithographic procedures based on these powerful UV sources. A final series of experiments has extended pulsed UV-laser reactions to area photodeposition of Al203 films.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 31, 1983
- Accession Number
- ADA134095
Entities
People
- D. H. Ehrlich
Organizations
- Massachusetts Institute of Technology