Discharge Kinetics of the Nickel Electrode.

Abstract

The kinetics of nickel electrode discharge are found to be controlled by solid-state proton diffusion under normal high rate discharge conditions. As the nickel electrode is discharged, the conductivity of the active material decreases until eventually mixed kinetics are observed where the electrode impedance has significant contributions from both proton diffusion and charge transfer resistance. Further discharge results in the formation of a semiconductor layer at the metal-active material interface that is depleted in charge carriers and has a relatively high electronic resistance. The depletion layer is responsible for the secondary discharge plateau of the nickel electrode at 0 to -0.5 volts vs. Hg/Hg0. Changes in electrode capacitance during depletion layer formation appear to provide a sensitive measure of the uniformity of electrode discharge. The effects of cobalt additives on the kinetics have been experimentally measured, and while cobalt does not change the discharge mechanism, it does increase the ionic and electronic conductivity of the active material allowing a greater depth of discharge before depletion layer formation. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Sep 15, 1983
Accession Number
ADA134389

Entities

People

  • Albert H. Zimmerman
  • P. K. Effa

Organizations

  • The Aerospace Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Capacitance
  • Charge Transfer
  • Chemical Analysis
  • Chemistry
  • Conductivity
  • Current Density
  • Diffusion
  • Electrochemical Kinetics
  • Electrodes
  • Impedance
  • Kinetics
  • Materials
  • Physics
  • Physics Laboratories
  • Resistance
  • Security

Fields of Study

  • Materials science

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics