The Heating and Failure of Microelectronic Wires from an Electric Pulse.

Abstract

A derivation was made of equations governing the temperature profiles in microelectronic wires. Using these equations, the profiles were plotted for gold and aluminum wires at the minimum voltages required for failure and at two higher voltages. Curves were also plotted for the time required to reach the melting point of the wires as a function of the applied voltage. Finally, curves were plotted for the energy required to raise the wire temperature to the melting point as a function of applied voltage. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1982
Accession Number
ADA134592

Entities

People

  • Vernon A. Nieberlein

Organizations

  • United States Army Aviation and Missile Command

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Aluminum
  • Conductivity
  • Directed Energy Weapons
  • Electrical Conductivity
  • Energy
  • Equations
  • Heat Balance
  • Heat Capacity
  • Heat Energy
  • Heat Flux
  • Heat Sinks
  • High Voltage
  • Melting
  • Melting Point
  • Thermal Conductivity
  • Voltage
  • Wire

Fields of Study

  • Physics

Readers

  • Calculus or Mathematical Analysis
  • Pulsed Power and Plasma Physics.
  • Regression Analysis.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems