Ultrastructure Processing and Environmental Stability of Advanced Structural and Electronic Materials.

Abstract

The goal of this Multi-Investigator Research Program (MIRP) is to achieve an understanding of the science of ultrastructure processing. Ultrastructure processing refers to the manipulation and control of surfaces and interfaces to attain a new generation of high performance materials with predictable properties and environmental insensitivity. Problem areas that may benefit from the use of ultrastructure processing include: behavior of particulate solids, adhesion of fillers and reinforcers in composites, corrosion of glasses and glass-ceramics, fatigue of brittle materials, grain boundary attack of ceramics, effects of energetic particle beams, lifetime of non-oxide ceramics, electronic behavior of high band gap semiconductors, multiphase electronic components.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1983
Accession Number
ADA135107

Entities

People

  • L. L. Hench

Organizations

  • University of Florida

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Analysis
  • Chemical Compounds
  • Chemical Synthesis
  • Chemistry
  • Energy Bands
  • Glass Transition Temperature
  • Material Degradation Processes
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Mechanics
  • Silica Glass

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Powder metallurgy of Titanium alloys.
  • Reinforced Composite Materials

Technology Areas

  • Directed Energy
  • Microelectronics