Electronic Packaging and Interconnect Technology Working Group Report (IDA/OSD R&M (Institute for Defense Analyses/Office of the Secretary of Defense Reliability and Maintainability Study).

Abstract

This document records the activities and presents the findings of the Electronic Packaging and Interconnect Technology Working Group part of the IDA/OSD Reliability and Maintainability Study, conducted during the period from July 1982 through August 1983.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1983
Accession Number
ADA137336

Entities

People

  • R. J. Clark

Organizations

  • Institute for Defense Analyses

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Circuit Boards
  • Computer Programming
  • Computer Programs
  • Computers
  • Engineers
  • Fabrication
  • Integrated Circuits
  • Large Scale Integration
  • Manufacturing
  • Materials
  • Microwave Integrated Circuits
  • Printed Circuits
  • Semiconductors
  • Test And Evaluation
  • Test Methods
  • Very Large Scale Integration

Readers

  • Munitions and Ordnance Engineering
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics