Ion Implanted GaAs I.C. Process Technology

Abstract

This report covers the first quarter, Phase II of a program on ion implanted planar GaAs integrated circuit technology. The overall objective of this program is the development of a manufacturable process for high-speed low- power GaAs logic circuits. The goal for Phase I was to establish the technology, and demonstrate its viability by fabricating circuits reaching MSI complexity. The goal for Phase II is to achieve the capability of fabricating GaAs ICs of LSI complexity. The program involves the Rockwell International Science Center and three subcontractors; Crystal Specialties Inc., California Institute of Technology and Cornell University. The most important result obtained in this quarter is the verification of proper operation of an 8-channel multiplexer. This multiplexer, employing 64 gates, is the most complex GaAs IC built to date. The first multiplexer results show operation at moderate speed, 254 MHz clock rate with low power dissipation, 80 mW, for the entire circuit. Testing of wafers which are expected to demonstrate operation at higher speed is in progress.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1979
Accession Number
ADA139348

Entities

People

  • B. M. Welch
  • D. R. Chen
  • F. H. Eisen
  • R. C. Eden
  • R. Zucca

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Angle Of Incidence
  • Contractors
  • Data Analysis
  • Electron Mobility
  • Fabrication
  • Field Effect Transistors
  • Free Electrons
  • Integrated Circuits
  • Ion Implantation
  • Logic Gates
  • Materials
  • Materials Science
  • Measurement
  • Metal-Semiconductor Junctions
  • Schottky Diodes
  • Semiconductors
  • Statistical Analysis

Readers

  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Electronics Engineering
  • Software Engineering