Development of Capsular Adhesive Systems and Evaluation of Their Stability.

Abstract

Studies on microencapsulation of adhesive systems have ben conducted. Encapsulation trials have been carried out on anaerobic adhesives and epoxy resins. The resulting total capsular anaerobic adhesives were characterized. A capsular epoxy adhesive formulation was developed to form a 'one can' dry, free flowing granulate, heat curable. The epoxy capsules and the capsular adhesive are characterized. Comparative adhesion tests were performed with the encapsulated systems with regard to the original unencapsulated compositions.

Document Details

Document Type
Technical Report
Publication Date
Nov 10, 1983
Accession Number
ADA140083

Entities

People

  • O. R. Murillo

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Adhesives
  • Encapsulation
  • Epoxy Resins
  • Fluids
  • Microcapsules
  • Plastics
  • Resins
  • Test And Evaluation

Readers

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