Effect of Mechanical Stress on the Dielectric Properties of Wood,

Abstract

The effect of mechanical stress parallel to the electric field on the polarizability (dielectric constant) and equivalent parallel conductance of wood was studied as a possible means for monitoring drying stresses. For electric and mechanical stress parallel to the grain, the effect was observable in wood that was moisture equilibrated at 65 percent relative humidity or greater, but was rather small and variable and drifted considerably with time. For stresses perpendicular to the grain, the effect was nearly nonexistent when the mechanical stress was no greater than the proportional limit. The effect also was essentially nonexistent for wood at moisture content lower than about 7%. The effect was generally larger at lower frequencies and was practically negligible at frequencies as high as 100 kHz. These results indicate that dielectric measurements are not feasible as a measure of mechanical stress in wood.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1984
Accession Number
ADA140608

Entities

People

  • W. L. James

Organizations

  • Forest Products Laboratory

Tags

DTIC Thesaurus Topics

  • Charge Carriers
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Electric Fields
  • Films
  • Frequency
  • Materials
  • Measurement
  • Moisture Content
  • Molecules
  • New York
  • Optical Properties
  • Physical Properties
  • Refractive Index
  • Tensile Stress
  • United States

Fields of Study

  • Agricultural and Food sciences

Readers

  • Materials Science and Engineering.
  • Plasma Physics.
  • Thermal Physics or Thermal Science.