Durability of Structural Adhesively Bonded Systems,
Abstract
The present report deals with the mechanical behavior of the bonded system after curing and in service when exposed to different hygrothermal conditions. An analysis was developed which enable the prediction of adhesive residual thermal stresses after curing, their time-dependence on temperature and moisture conditions, and the resulting deformational behaviour of the bonded system. The non-linear viscoelastic behaviour of the adhesive under such circumstances was tackled by using advanced finite-element approach. The deformational behaviour of a non-symetrical bonded specimens were exmained through experimental investigation. Analytical results indicate a significant Hygrothermal effects on stress relaxation in the adhesive at the viscoplastic range. A mathematical tool was developed to deal with the effect of stresses on interlaminer crack propagation. This will, provide the first step toward the prediction of failure initiation and propagation within the bonded phases, which is the objective of the next stage of the present project.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1983
- Accession Number
- ADA140714
Entities
People
- E. Altus
- G. Yaniv
- O. Ishai