Direct Writing of Microstructures for Microelectronics

Abstract

A program to investigate direct laser writing for semiconductor processing is described. In this program the following results were obtained: The first reported fabrication of submicrometer diffraction gratings in GaAS; Development of a new technique for writing patterns of the dielectric material, SiO2; Measurement of the conductivity and properties of metal interconnects; The first demonstration of laser-enhanced plasma etching; and The first observation of deep-UV enhanced liquid etching of GaAS.

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Document Details

Document Type
Technical Report
Publication Date
Jul 09, 1984
Accession Number
ADA144528

Entities

People

  • Richard M. Osgood, Jr.

Organizations

  • Columbia University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Argon Lasers
  • Chemical Reactions
  • Chemistry
  • Compound Semiconductors
  • Dielectrics
  • Diffraction
  • Fabrication
  • Ion Lasers
  • Laser Beams
  • Lasers
  • Materials
  • Measurement
  • Optical Properties
  • Optics
  • Semiconductor Devices
  • Semiconductors
  • Ultraviolet Lasers

Readers

  • Optical Physics and Photonics.
  • Semiconductor Device Technology

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Graphene