Thermomechanical Cracking in Layered Media from Moving Friction Load,

Abstract

This investigation studies a two-dimensional model of a layered medium subjected to the frictional excitation of a high-speed asperity traversing over the surface of the medium. The general analytical solutions of the mechanical stress state, the temperature field and the thermal stress state are obtained and expressed in the Fourier transform expressions. Numerical solutions are carried out for cases of uniform and parabolic pressure distributions. The resulting stress state yields the conditions for the asperity to initiate cracks in the layered medium. This paper studies, further, the thickness effect of the surface layer, the effect of relative stiffness of the surface layer and the substrate, and the effect of an insulating layer versus a conductive layer. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1984
Accession Number
ADA146022

Entities

People

  • F. D. Ju

Organizations

  • University of New Mexico

Tags

Communities of Interest

  • C4I

DTIC Thesaurus Topics

  • Elastic Properties
  • Equations
  • Failure Mode And Effect Analysis
  • Friction
  • Integrals
  • Mathematical Models
  • Mechanics
  • Models
  • Modulus Of Elasticity
  • Pressure Distribution
  • Stresses
  • Substrates
  • Temperature Gradients
  • Thermal Stresses
  • Thermoelasticity
  • Thickness
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Nanofabrication and Microfabrication.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene