Encapsulation/Fixation (E/F) Mechanisms.

Abstract

The objective of this project was to examine the chemical and/or physical bonds created in the process of encapsulating/fixing AAP-type sludges. Typical sludge compositions were selected for detailed study on review of sludges generated during wastewater treatment and related operations at 22 Army facilities. Candidate fixatives included polysilicates, amine-cured polyepoxides and polysulfides. A limited study was also conducted using ion-exchange resins of the non-ionic type for sludges containing TNT and rdx; and cationic exchangers with specific chemically reactive groups for sludges containing heavy metals. The measure of effectiveness of the AAP sludge-fixative combination was EPA's EP Toxicity Test. Instrumentation characterization methods included optical microscopy, infrared spectroscopy, scanning electron microscopy, energy-dispersive X-ray analysis, and X-ray diffraction. Polysilicates were found to fix heavy metals as a consequence of the highly alkaline-buffered media they provide. Nitrocellulose was observed to react with epoxy ingredients with the possible removal of nitrato groups. Studies with polysulfides and ion-exchange resins were encouraging, resulting in chemically fixed sludges of high contaminant density and resistance to leaching.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 18, 1984
Accession Number
ADA146177

Entities

People

  • D. R. Taylor
  • E. Mishuck
  • H. Lubowitz
  • R. Telles

Tags

Communities of Interest

  • Biomedical
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Calcium Compounds
  • Chemical Elements
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Organic Acids
  • Sodium Compounds
  • Waste Products

Fields of Study

  • Materials science

Readers

  • Agricultural Chemistry/Soil Science
  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics