Mechanical Properties of Adhesively Bonded Aluminum Structures Protected with Hydration Inhibitors,

Abstract

The use of several amino phosphonic acids as hydration inhibitors to improve the properties of adhesively bonded aluminum structures has been investigated using T-peel, double-lap-shear, and wedge tests. Each of the inhibitors tested was found to be compatible with epoxy adhesives in a dry environment. Most were also compatible in a hot, humid environment. Examination of both sides of the propagated crack in wedge test specimens treated with nitrilotris methylene phosphonic acid (NTMP) showed that hydration of the oxide could be slowed sufficiently so that crack propagation occurred prior to it. In this case, the weakest link was the coupling of the inhibitor to the adhesive. Inhibitors designed to strengthen this coupling have been synthesized and are currently being tested.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1984
Accession Number
ADA148123

Entities

People

  • G. D. Davis
  • J. D. Venables
  • J. S. Hearn
  • L. J. Matienzo

Organizations

  • Martin Marietta

Tags

Communities of Interest

  • Advanced Electronics
  • Space

DTIC Thesaurus Topics

  • Acids
  • Adhesives
  • Alcohols
  • Aluminum
  • Aqueous Solutions
  • Chemical Synthesis
  • Chemistry
  • Crack Propagation
  • Electron Microscopes
  • Environment
  • Failure Mode And Effect Analysis
  • Hydroxides
  • Mechanical Properties
  • Metals
  • Organic Acids
  • Organic Chemistry
  • Phosphonic Acids

Readers

  • Materials Science (Mechanical Engineering).
  • Surface Coatings Technology.