Optimisation of the Thermoelectric Figure of Merit in Fine Grained Semiconductor Materials Based upon Lead Telluride,

Abstract

It has been reported that grain boundary scattering has a significant effect in reducing the lattice thermal conductivity of silicon germanium alloys. This phenomenon does not appear to be accompanied by a deterioration in the other parameters which occur in the thermoelectric figure of merit. Consequently, small grain size silicon germanium alloys exhibit a higher figure of merit than comparable 'single crystal' or large grain size material. Although grain boundary scattering of phonons is particularly favoured in silicon germanium alloys because the large difference in atomic masses of the constituent atoms give rise to substantial alloy disorder scattering, this phenomenon will also be present in other thermoelectric semiconductor alloys.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1982
Accession Number
ADA148710

Entities

People

  • C. M. Bhandari
  • D. M. Rowe

Organizations

  • University of Wales

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Alloys
  • Band Gaps
  • Boundaries
  • Energy
  • Energy Bands
  • Energy Gaps
  • Figure Of Merit
  • Germanium
  • Germanium Alloys
  • Grain Boundaries
  • Grain Size
  • Lead Tellurides
  • Materials
  • Semiconductors
  • Solid State Physics
  • Tellurides
  • Thermal Conductivity

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Semiconductor Device Technology
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene