Lithography Radiation Effects Study.

Abstract

An experimental x-ray lithography facility for irradiating thin films of a photoresist next to a gold mask is described. The x-ray irradiance and PMMA irradiation times are estimated for several target elements with characteristic x-ray lines in the 1-3 keV energy range. A gold mask (6800 A thick) deposited with films of carbon 100, 220, 520 and 710 A thick were placed next to films of PBS resist and irradiated with x-rays from A1, Ag, and Ti targets bombarded by 10 keV electrons. The exposed PBS was etched for a fixed time interval, and the thickness of the etched resist next to the varying film thickness of carbon was measured by optical ellipsometry. The plot of etched PBS thickness vs. carbon film thickness gave a measure of the depth of penetration of x-ray photoelectrons from the gold mask into the resist and a possible method of measuring dose-depth profiles at material interfaces at soft x-ray energies. A realistic, calculational model that includes source bremsstrahlung predicts fairly well experimental dose profile for the Au/C mask.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1984
Accession Number
ADA149552

Entities

People

  • B. W. Murray

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Absorption Coefficients
  • Accuracy
  • Computer Programs
  • Detectors
  • Electric Fields
  • Electron Energy
  • Electrons
  • Energy
  • Ionizing Radiation
  • Measurement
  • Photoelectrons
  • Refractive Index
  • Soft X Rays
  • Spectra
  • Thin Films
  • X Ray Spectra
  • X Rays

Fields of Study

  • Physics

Readers

  • Nuclear and Radiation Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene