Design of a Bit-Sliced Processor Array with Built-In-Self-Test.

Abstract

The overall objective of this report is to present an integrated approach to the design of bit-sliced processor arrays with built-in self-test. The conventional approach of making each bit-sliced processor chip self-testing is not used. Rather, a new approach of using an extra chip to test a processor array fo any size and itself is used. The classical stuck-at fault model is not suitable for VLSI circuits. Rather, a functional level fault model is used. Ech module of the processor array is tested exhaustively. The test responses of a fault-free processor array are made identical so that they can be easily monitored with no loss in fault coverage. The tester chip tests itself while it is testing the processor array. The fault coverages for both the tester chip and the processor array are high; the performance degradation is minimal; the area overhead is low, especially for large processor arrays; and the test length is short so tests can be performed more frequently. A VLSI design of the tester chip has been done with a 2-microns NMOS process. (Author)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1984
Accession Number
ADA149785

Entities

People

  • P. C. Mui

Organizations

  • University of Illinois Urbana–Champaign

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Algorithms
  • Circuits
  • Computers
  • Data Compression
  • Degradation
  • Demographic Cohorts
  • Electrical Engineering
  • Illinois
  • Integrated Circuits
  • Semiconductors
  • Simulations
  • Test Sets
  • Three Dimensional
  • Two Dimensional
  • Universities
  • Verification

Fields of Study

  • Engineering

Readers

  • Aerospace Test and Evaluation
  • Fault Tolerant Diagnosis of Black and White Balloon Isolation Tests Using ¥.
  • Integrated Circuit Design and Technology.