Microscopic Study of the Influence of Impurities on Interface Bonding.

Abstract

Research on the relation between impurities and second phases at interfaces and their impact on the mechanical properties is reported. Model layered systems involving interfaces in Al/graphite MMC and the Ni-Ni system were investigated. In addition model steel systems, both ferritic and austenitic were studied to evaluate segregation to the interface and the impact on fracture and stress corrosion cracking of the segregated species. In the layered structures the relation between the conductivity normal to the interface and the fracture path was evaluated under different interface processing conditions with a variety of experimental results. The method of preparation of the interface played a major role in the switching and fracture characteristics. In the steels a correlation between the segregation at the interface and the fraction of interface failure with the fracture toughness was evaluated. Originator supplied keywords include: Auger electron spectroscopy, Interface characteristics, Interface fracture, Scanning auger microscopy, I/V switching, Metal matrix composites, Aluminum/graphite composites, Mn stainless steels, Intergranular fracture.

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Document Details

Document Type
Technical Report
Publication Date
Jan 25, 1985
Accession Number
ADA151725

Entities

People

  • H. L. Marcus

Organizations

  • University of Texas at Austin

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Chemical Synthesis
  • Chemistry
  • Crystal Structure
  • Heat Treatment
  • Material Degradation Processes
  • Materials
  • Materials Engineering
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Mechanics
  • Metal Matrix Composites
  • Metallurgy
  • Oxide Films
  • Stress Corrosion Cracking

Fields of Study

  • Materials science

Readers

  • Metallurgy
  • Powder metallurgy of Titanium alloys.
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics