Automated Polymer Die Attach Machine.

Abstract

The report which follows specifies the program plan, technical plan and statement of work associated with the development and construction of an automated polymer die attach machine for subsequent utilization in a high rate manufacturing environment. The current trend throughout the military hybrid industry is the reduction of operator controlled variables in an effort to reduce cost while maintaining or increasing equipment volume handling capability. The purpose of this manufacturing technology program is to develop a semi-automatic chip recognition Die Bonding System. Originator supplied keywords include: Automatic die attachment; Hybrids; Polymer die attachment; Die recognition systems; Robotics.

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Document Details

Document Type
Technical Report
Publication Date
Jan 13, 1981
Accession Number
ADA152108

Entities

People

  • G. M. Coppus
  • G. N. Hunter

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Air Platforms
  • Human Systems
  • Weapons Technologies

DTIC Thesaurus Topics

  • Automatic
  • Classification
  • Contractors
  • Contracts
  • Engineering
  • Governments
  • Images
  • Machines
  • Manufacturing
  • Mass Production
  • Materials
  • Orientation (Direction)
  • Production
  • Recognition
  • Semiconductors
  • Substrates
  • Video

Fields of Study

  • Engineering

Readers

  • Distributed Systems and Data Platform Development
  • Educational Psychology
  • Women's Health and Cancer Risk Research: African American Women and Pregnancy Outcomes.

Technology Areas

  • AI & ML
  • AI & ML - DoD AI Strategy
  • Autonomy