Microcircuit Package Sealing and Leak Testing.
Abstract
The U.S. Army Missile Command, DRSMI-ET, Redstone Arsenal, Alabama, (herinafter referred to as MICOM) produced a high-throughput unified system for sealing and leak-testing microcircuit metallic packages. This system was custom-designed and built under the technical direction of MICOM by the collaboration of a number of contractor companies, as an MM&T task. The ultimate objective of the task was to advance the capability of the DoD/Industry team in the ares of high-volume production of high-reliability cost-effective hermatically-sealed metallic-packaged hybrid microcircuit modules, by the development and demonstration of this unified sealing and leak-testing system. Contract No. DAAHO1-80-C-0349 was awarded by MICOM to Huntsville Microcircuits, Inc. (hereinafter referred to as HMI) with the objective that HMI procure sample metallic packages for use in the development and demonstration of the MICOM sealing/leak-testing system, and provide engineering labor support for the evaluation, demonstration, and documentation of that system. The specific requirements delineated in the Scope of Work, page 10 of the subject Contract, defined the framework for this effort.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 29, 1981
- Accession Number
- ADA153575
Entities
People
- W. R. Clayton