The Measurement of Strain Fields by X-Ray Topographic Contour Mapping.

Abstract

X-ray diffraction topography offers unique advantages for imaging dislocations and accumulated plastic deformation in single crystals. X-ray diffraction is much more sensitive to strains and samples larger volumes of material than does electron microscopy. Also, topography can be used non-destructively to examine a single specimen many times during the course of an experiment. With the advent of synchrotron radiation sources and of rapid imaging systems for laboratory sources, the emphasis in applying x-ray topography is shifting from characterization studies to dynamic, in-situ observation of experiments. One such application is observation of plastic deformation during tensile or bending tests. An x-ray topographic method is described for measuring the magnitude of the components of the strain tensor as a function of position in single crystal specimens. Several variants of the technique are described for use with monochromatic or white x-radiation. Results are reported for some components of the deformation field surrounding a precipitate of beta-NbH. Possible applications of contour mapping are discussed.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
May 01, 1985
Accession Number
ADA154870

Entities

People

  • Haoze Chen
  • Howard K. Birnbaum
  • S. R. Stock

Organizations

  • University of Illinois Urbana–Champaign

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Continuum Mechanics
  • Diffraction
  • Electron Microscopes
  • Electron Microscopy
  • Engineered Materials
  • Engineering
  • Illinois
  • Materials
  • Materials Engineering
  • Materials Science
  • Mechanics
  • Microscopes
  • Microscopy
  • Military Research
  • Synchrotron Radiation
  • X Rays
  • X-Ray Diffraction

Fields of Study

  • Physics

Readers

  • Geodesy
  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.

Technology Areas

  • Microelectronics