Microenvironmental Moisture Research.
Abstract
The advancement of the science of reliability physics is the foundation for increased microelectronic circuit reliability. A common denominator for many types of failure mechanisms in integrated circuits is water trapped within the package cavity. Because of the nature of water in all types of circuits, an understanding of the fundamental interaction of water with package materials is essential. The research reported here was aimed at elucidating the nature of its sources, its dynamics of interaction, and ultimately its role in failure mechanisms. The nature and past history of surfaces is well known to influence its adsorption/desorption properties particularly with respect to water. It is necessary, therefore, to establish the chemical composition and morphology of the surface under investigation. All test structures and their treatment should closely approximate those found in production run packages in order to infer parallel response characteristics. The preparation and treatment of test samples for use in the work reported herein was done so as to simulate various stages of manufacturing. Comparison to production samples was done where possible. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1985
- Accession Number
- ADA157059
Entities
People
- J. H. Linn
- J. M. Ammons
- M. G. Kovac
- W. E. Swartz
Organizations
- University of South Florida