Stress Level Testing of Electronics, Avionics Communications and C3I Equipments.

Abstract

This Test Operations Procedure (TOP) describes test methods and techniques for measuring and evaluating the technical performance of a System Under Test (SUT) when the SUT is operated to and beyond specifications in order to determine its response to high levels of stimuli. The extremely short period allowed for the writing of this TOP along with the great diversity of potential systems to be tested has precluded the writing of a document which conclusively covers the topic of stress level testing. This document should b considered as a TOP which outlines the basic requirements and the basic test methodology for conducting stress level testing. This TOP includes only the electronics aspect of stress level testing. It does not consider the classical environmental and mechanical stress testing of materials; these types of stress testing are covered in MIL-STD-810D. Keywords include: Stress Loading, Simulating and Modeling Functions, Complex Electromagnetic Environment, Repeatable RF Stimuli, Real Time Operation, Direct coupled RF, Close Coupled RF, Digital Techniques, Low Powered Techniques, Scenario Driven, Stress Tests, Avionics, Communication, Electronics, and C3I.

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Document Details

Document Type
Technical Report
Publication Date
Aug 30, 1985
Accession Number
ADA159395

Entities

Organizations

  • United States Army Test and Evaluation Command

Tags

Communities of Interest

  • Advanced Electronics
  • C4I
  • Human Systems
  • Sensors

DTIC Thesaurus Topics

  • Amplitude Modulation
  • Command And Control
  • Command And Control Systems
  • Computer Programs
  • Control Systems
  • Data Reduction
  • Electronic Countermeasures
  • Electronic Warfare
  • Field Tests
  • Frequency
  • Modulation
  • Radio Frequency
  • Simulators
  • Test And Evaluation
  • Test Equipment
  • Test Methods
  • Vulnerability

Fields of Study

  • Engineering

Readers

  • Aerospace Test and Evaluation
  • Structural Health Monitoring of Composite Structures.
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems