Dielectric Analysis of Thermoset Cure.

Abstract

Measurements of dielectric properties have been used to monitor chemical reactions in organic materials for more than fifty years. This review addresses the application of dielectric measurements to thermosetting polymers including basic dielectric properties, the methods used to measure these properties, key experimental artifacts that must be understood by the investigator, the physical origin of those artifacts, and a survey of the current published literature with emphasis on the correlations between dielectric properties and other physical properties of the material. Keywords: dielectric properties; thermosetting polymers; permittivity; loss factor; loss tangent; conductivity; resistivity; epoxy resins; polyimides; polyesters; phenolics; ionic impurities; dipole relaxation; microdielectrometry; Williams-Landel-Ferry equation; WLF equation; viscosity; and cure.

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Document Details

Document Type
Technical Report
Publication Date
Oct 07, 1985
Accession Number
ADA160291

Entities

People

  • N. F. Sheppard Jr.
  • S. D. Senturia

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Chemical Kinetics
  • Chemical Reactions
  • Chemistry
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Electrical Engineering
  • Electrical Properties
  • Epoxy Resins
  • Geometry
  • Materials
  • Materials Laboratories
  • Materials Science
  • Measurement
  • Measuring Instruments
  • Plastics
  • Resins

Readers

  • Materials Science and Engineering.
  • Polymer Science and Engineering.