Composite Strengthening.

Abstract

Annealed aluminum/silicon carbide (Al/SiC) composites exhibit a relatively high density of dislocations frequently decorated with fine precipitates in the Al matrix that contributes to the unexpected strength of these composite materials. The large difference (10:1) in the coefficient of thermal expansion (CTE) between Al and SiC results in sufficient stress to generate dislocations at the Al/SiC interface during cooling. In this in situ investegation, using a High Voltage Electron Microscope (HVEM) equipped with a double tilt heating stage, composite samples were observed during heating to 800 K and cooling to ambient temperatures to determine the density of dislocations generated at the Al/SiC interface during cooling. Two types of bulk annealed composites were examined: one with SiC of discontinuous whisker morphology and one of platelet morphology. In addition, control samples with O V% SiC were examined. Both types of composites showed the generation of dislocations at the Al/SiC interface resulting in densities > 1,000,000,000/sq. cm. One sample viewed end-on to the whiskers showed only a rearrangement of dislocations, whereas the same material when sectioned so that the lengths of whiskers were in the plane of the foil, showed the generation of dislocations at the ends of the whiskers on cooling. The control samples did not show the generation of dislocations on cooling except at a few large precipitate particles.

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1984
Accession Number
ADA161615

Entities

People

  • R. J. Arsenault

Organizations

  • University of Maryland

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Ceramic Materials
  • Composite Materials
  • Compound Semiconductors
  • Demographic Cohorts
  • Dislocations
  • Electron Microscopes
  • High Density
  • High Voltage
  • Materials
  • Microscopes
  • Precipitates
  • Silicon Carbide
  • Thermal Expansion

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics