The Electroplating of Laminated Chromium.

Abstract

A microprocessor-controlled flow plating process was developed to deposit laminated chromium consisting of alternating layers of low contraction (LC) and high contraction (HC) chromium. The automated plating system contains a large number of variable parameters designed to allow the use of multiple plating modes. The available modes include a combination of direct current, interrupted, periodic reverse, pulse, and laminated chromium plating. The laminated plating experiments were conducted at LC/HC solution temperatures of 85 and 55 C, current densities of 120 and 45 A/dm sq, and at LC/HC duty cycles to produce spacings between 0l01 and 2.7 micrometers. Under these plating conditions, deposits with hardness values between 655 and 1089 KHN and tensile strengths between 6.8 and 57.2 were obtained.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1985
Accession Number
ADA162751

Entities

People

  • E. S. Chen
  • G. P. Capsimalis
  • G. R. Weigle

Organizations

  • United States Army Armament Research, Development and Engineering Center

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Chromium
  • Coatings
  • Current Density
  • Direct Current
  • Electrodeposition
  • Electroplating
  • Engineering
  • Hardness
  • Materials
  • Materials Processing
  • Materials Science
  • Mechanical Properties
  • Military Research
  • Orientation (Direction)
  • Tensile Strength
  • Thermal Expansion
  • X-Ray Diffraction

Readers

  • Electrical Engineering
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Space
  • Space - Hall-Effect Thruster