Investigation of Marginal Voltage Analysis for Defect Location in Integrated Circuits.
Abstract
Digital integrated circuits tend to be classified as either good or bad when tested by standard equipment. Standard testing techniques fail to detect a group of circuits that pass normal testing but then fail after a short time of actual use. These circuits represent a reliability hazard for systems. For high reliability applications a burn-in test is used to eliminate these devices with latent defects. Some devices though survive the burn-in test only to fail later for reasons usually associated with failure mechanisms that are not accelerated by the burn-in test. An alternate screening technique is needed to eliminate these devices. A technique for detecting these reliability rogues has been studied along with a modification to the technique that will allow a more rapid location of the physical defect sites. Keywords include: Reliability; Testing; Failure analysis; and Fault detection.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1985
- Accession Number
- ADA163033
Entities
People
- E. H. Maher