Preparation and Characterization of Alumina Films by Sol-Gel Method.

Abstract

The method of producing a good dielectric layer such as A12O3 on a III-V semiconductor such as InP is limited by the thermal stability of the substrate. Since InPis reported to be stable only up to about 360 C (1), low temperature synthetic methods must be employed to produce insulating films. A low temperature sol-gel method was used to apply a thin film of alumina on indium phosphide substrates by spin application. The resultant films were characterized by ellipsometry and electron microscopy to determine thickness and porosity. The current-voltage characteristics of the films were measured as a function of annealing temperature.

Document Details

Document Type
Technical Report
Publication Date
Jan 29, 1986
Accession Number
ADA163548

Entities

People

  • Aaron Wold
  • J. Baglio
  • Kirby Dwight
  • R. Brusasco
  • Robert N. Kershaw

Organizations

  • Brown University

Tags

DTIC Thesaurus Topics

  • Annealing
  • Compound Semiconductors
  • Electron Microscopy
  • Electronics
  • Electrons
  • Films
  • Low Temperature
  • Microscopy
  • Physical Properties
  • Porosity
  • Semiconductors
  • Solid State Electronics
  • Substrates
  • Thermal Stability
  • Thickness
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene