Comparison of Notch Strength between Gr/PEEK (APC-1 and APC-2) and Gr/Epoxy Composite Materials at Elevated Temperature.

Abstract

Thermoplastics have been developed to improve fracture toughness compared to the widely used thermosetting polymers such as epoxy systems. A semi-crystalline thermoplastic, poly-ether-ether-ketone(PEEK), matrix has been developed with significant toughness improvement over thermosets. A review of literature resulted in very little information related to the Aromatic Polymer Composite-2 (APC-2) which is formed from graphite fibers (60% volume) and PEEK. The experimental study reported herein was conducted to investigate the high temperature strength (tension and compression) of APC-2 laminates with holes. The experimental data was then used to determine parameters necessary to predict failure stress trends for the average stress failure criterion, point stress failure criterion, and a three parameter model failure criterion. The comparison of experimental and predicted failure strengths are depicted graphically. The failure modes of APC-2 are also studied utilizing the scanning electron microscope.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1985
Accession Number
ADA164033

Entities

People

  • Joe E. Ramey Jr

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Composite Material Fabrication
  • Composite Materials
  • Failure Mode And Effect Analysis
  • Laminates
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Working
  • Mechanics
  • Notch Sensitivity
  • Plastics
  • Polymer Matrix Composites
  • Reinforced Plastics
  • Resins
  • Thermoplastic Resins

Fields of Study

  • Materials science

Readers

  • Molecular Biology and Genetics
  • Reinforced Composite Materials
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics