Minuteman Stage III Operational Surveillance Program Seven-Year Testing Bondline Aging Study,

Abstract

The program objective is to provide material properties aging data at silo conditions (70 + or - 5 F, 50 + or - 5 percent RH) for liner bond strength, ANB-3066 propellant, SD-851-2 liner, and V-45 insulation from selected locations of three Minuteman Stage III motors. These data are to be used to relate the conditions of the dissected motors to those of operational motors (via excise samples) and to compare and adjust the age of all of these to the Stage II nominal liner degradation curve. This report contains results of the yearly material properties testing of Stage III motor segments in the 12-year bondline aging study. Also reported are the results obtained in the continued testing/monitoring of Motor TC 30024 (LRSLA Simulated Aging Test No. 3), as are the second year results of tests upon the bondline materials and propellants obtained from dissected stage III segments of Motor TC 30072. The twelve-year bondline aging study uses segments removed from three in-process reject motors which were cast in 1971 and were rejected due to apex voids. Segments maintained at silo conditions are being used to track bondline aging of Stage III motors with testing of material properties being performed at one-year intervals to 1990.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1985
Accession Number
ADA164288

Entities

People

  • Michael R. Knight

Tags

Communities of Interest

  • C4I
  • Human Systems

DTIC Thesaurus Topics

  • Degradation
  • Hardness
  • Inspection
  • Intercontinental Ballistic Missiles
  • Materials
  • Mechanical Properties
  • Metal Matrix Composites
  • Moisture
  • Moisture Content
  • Plastic Explosives
  • Propellants
  • Surveillance
  • Tank Guns
  • Tensile Strength
  • Tensile Testing
  • Test Methods
  • Visual Inspection

Readers

  • Rocket Propulsion.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems