Comprehensive Chemical Analysis of Metal Alloys by Means of Inductively Coupled Plasma Optical Emission Spectroscopy

Abstract

The purpose of this study was extend the analysis capability of inductively coupled plasma (ICP) optical spectroscopy to as many different copper, aluminum, and iron base alloys as possible, and investigate the development of analytical methods capable of determining all important elements in a particular base through the use of a single set of analytical lines and a single preparation method. Analyses of standard reference materials show that the analysis lines used were effective for determining those elements which can be brought into solution, particularly copper, chromium, cobalt, manganese, molybdenum, silicon, vanadium, and phosphorous. Other materials, notably aluminum, boron, titanium, niobium, tungsten, and zirconium in an iron base were more difficult to analyze, probably because they form carbides or other species that are difficult to dissolve. The uses of NaOH/H2O2 to dissolve aluminum base material and HC1/H2O2 to dissolve copper base material show promise as good comprehensive dissolution techniques. The conductive solids nebulizer (CSN) proved effective in by passing the dissolution step. Keywords: Metallurgy and metallography, Physical chemistry, Inorganic chemistry, Chemical analysis, Inductively coupled plasma, Metal alloys.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1985
Accession Number
ADA166842

Entities

People

  • W. E. Glad

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Acids
  • Alloys
  • Chemical Analysis
  • Chemistry
  • Chromium
  • Detection
  • Elements
  • Emission Spectroscopy
  • Hydrochloric Acid
  • Hydrogen
  • Materials
  • Materials Science
  • Nitric Acid
  • Rocket Oxidizers
  • Spectroscopy
  • Stainless Steel

Fields of Study

  • Materials science

Readers

  • Analytical Chemistry
  • Pulsed Power and Plasma Physics.
  • Surface Engineering/Surface Coating Technology.