Study of a Process for the Deposition of a Metal Adhesive Intermediate for use in Removable Prosthetic Appliances.

Abstract

A feasibility study on the electroless or chemical plating of silver onto tooth surfaces has been conducted. A process has been developed that allows metallic silver to be bonded intimately to an enamel or dentin substrate. The conditions used to produce the coatings are detailed and the influence of various processing parameters on their properties is outlined. The highlights and conclusions were: A process has been perfected which allows extracted teeth to be electrolessly plated using cotton swab applicators to apply the solutions; Both copper and silver coatings have been successfully applied by the swab applicator techniques; Metal adherence to the tooth seems to be good, and rough estimates of the bond strength are 1000 psi. This value is in line with strengths obtained for commercial electroless plating on plastics. The coatings will resist abrasion using standard dental hand tools (such as picks) but can be removed with rotary tools (such as abrasion or polishing wheels). Thicknesses of the order 0.0003 inches have been obtained for the standard plating process now being used. The time required to produce this thickness was approximately 8 minutes. The amount of metal deposited is directly proportional to the time of plating. Thus, thicker deposits may probably be obtained, but the time required would be increased.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1984
Accession Number
ADA167814

Entities

People

  • Thomas J. O'keefe

Tags

Communities of Interest

  • Biomedical

DTIC Thesaurus Topics

  • Adhesion
  • Coatings
  • Current Density
  • Dental Materials
  • Electroless Plating
  • Electron Microscopy
  • Films
  • Hydroxides
  • Materials
  • Measurement
  • Metal Coatings
  • Microscopes
  • Reducing Agents
  • Resistance
  • Shear Stresses
  • Teeth
  • Wear Resistance

Readers

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  • Nanofabrication and Microfabrication.
  • Polymer Science and Engineering.