Improved Adhesion of Thin Conformal Films to Metal Surfaces.

Abstract

A technique is described for attaching thin, conformal, pin-hole free electrically insulating polyethylene films to flat gold surfaces (previously modified by adsorption of a monolayer of an organic disulfide) by plasma polymerization. These polyethylene films are tough enough to support the attachment of gold electrodes. The adhesion of plasma polymerized polyethylene (PPE) thin films to a gold surface can be dramatically improved by coupling the synthesis of the PPE thin film with the prior assembly of an organic monolayer chemisorbed to the metal surface. These thin film assemblies have good physical characteristics and are stable to the ambient environment for long intervals. This method should be applicable to other systems with appropriate modifications.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1986
Accession Number
ADA168616

Entities

People

  • George M. Whitesides
  • Herman P. Godfried
  • Isaac F. Silvera
  • Kevin R. Steward

Organizations

  • Harvard University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • California
  • Chemistry
  • Dielectric Polymers
  • Dielectrics
  • Engineering
  • Fabrication
  • Massachusetts
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Military Research
  • Monomolecular Films
  • New York
  • Thin Films
  • United States

Readers

  • Surface Coatings Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene