Oxidation of Silicon, Silicon Carbide (SiC) and Silicon Nitride (Si3N4)

Abstract

Si, SiC, and Si3N4 are important materials. They are widely used for their electrical properties in the construction of semiconductor devices, and SiC and Si3N4 have important uses as hard and relatively oxidation-resistant ceramics. The carefully controlled oxidation of Si to SiO2 is used in the fabrication of semiconductors. Because of the many similarities in the oxidation chemistry of the three substances, they are treated together in this report so that useful comparisons can be made. The major questions to be addressed are: What are the oxidation reactions and what is the detailed mechanism by which they occur; How do these oxidation processes depend on: a) the form that the material takes, e.g., processing procedure, crystal structure, b) temperature, and c) oxygen pressure. Although other oxidants, e.g., H2O, either alone or in combination with O2 also oxidize these materials, this report will deal with O2 exclusively. Each of the above questions will be addressed in detail for each of the three materials.

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Document Details

Document Type
Technical Report
Publication Date
Jun 04, 1986
Accession Number
ADA168886

Entities

People

  • K. H. Stern

Organizations

  • United States Naval Research Laboratory

Tags

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Reactions
  • Chemical Synthesis
  • Chemical Vapor Deposition
  • Chemistry
  • Compound Semiconductors
  • Crystal Structure
  • Crystals
  • Decomposition
  • Films
  • Materials
  • Materials Science
  • Oxidation
  • Oxides
  • Semiconductor Devices
  • Semiconductors
  • Silicon Carbide

Fields of Study

  • Materials science

Readers

  • Surface Engineering/Surface Coating Technology.
  • Theoretical Analysis.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene