An Analysis of Shear Band Development Incorporating Heat Conduction.
Abstract
We incorporate the effects of material temperature sensitivity and heat conduction into an infinite band type analysis of shear localization. Full account is taken of finite geometry changes, but inertial effects are neglected. An energy balance is written between homogeneously deforming bands in a manner that models conditions in our recent finite element study of shear band development from internal inhomogeneities in a solid subject to plane strain compression. The band analysis requires specification of an imperfection amplitude and a length scale over which heat conduction effects are significant. These are chosen to match results of a finite element analysis. The predictions of the simple band analysis and the results of full finite element calculations are then compared for a wide range of material properties for both isotropic and kinematic hardening characterizations of the flow potential surface. The predicted dependence of the onset of localization on material properties such as strain hardening and strain rate sensitivity is the same for both types of analysis. Keywords: Thermoplastic instability; Thermal softening.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1986
- Accession Number
- ADA168972
Entities
People
- A. Needleman
- J. Lemonds
Organizations
- Brown University