1984 IR&D (Independent Research and Development) Advanced Packaging Study.

Abstract

An advanced multiyear electronic packaging project has been started. The project is a comprehensive interactive one involving theory, modeling, structure fabrication, and reliability testing. Highlights of the first year's activities are presented in this report. Important results include: the creation of integrated thermal and thermomechanical models, the prediction of lifetimes under environmental and operational stress conditions, model verification and validation by carefully controlled experimentation, development of assembly techniques, and the invention of a new method for preparing controlled solder joint height and geometry. Keywords: Electronic packaging; VLSI/VHSIC packaging; Thermal analysis; Thermal modeling; Finite-element modeling; thermomechanical analysis; Chip carriers; Solder reflow.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1986
Accession Number
ADA169388

Entities

People

  • G. V. Clatterbaugh
  • H. C. Charles Jr

Organizations

  • Johns Hopkins University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Creep
  • Electronics
  • Fabrication
  • Fatigue Life
  • Geometry
  • Heat Transfer
  • High Temperature
  • Materials
  • Mechanical Properties
  • Mechanical Working
  • Physics Laboratories
  • Shear Tests
  • Soldered Joints
  • Stress Analysis
  • Stress Concentration
  • Stresses
  • Thick Films

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems