Report on an Interlaboratory Electromigration Experiment,

Abstract

Electromigration is a metallization failure mechanism that is of concern for Very Large Scale Integration reliability. Ambiguities exist in the electromigration characterization of metallizations. These ambiguities are, in general, due to the different test structures and measurement methodss used and to the incomplete reporting of the results from such characterizations. An interlaboratory experiment has been organized to address this problem. The purpose of the experiment is to assess the reproducibility of electromigration characterizations and to establish the technical base needed to develop guidelines for the design of electromigration test structures, for methods to measure the median time to failure of metallizations, and for reporting characterization measurements.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1986
Accession Number
ADA169652

Entities

People

  • Harry Schafft
  • John Mandel
  • John Shott
  • Tammy Grant

Organizations

  • Stanford University

Tags

DTIC Thesaurus Topics

  • Ambiguity
  • Circuits
  • Current Density
  • Damage Detection
  • Failure Mode And Effect Analysis
  • Heat Of Activation
  • Information Science
  • Measurement
  • Quadrants
  • Reproducibility
  • Resistance
  • Right Angles
  • Short Circuits
  • Standards
  • Stress Tests
  • Test Methods
  • Very Large Scale Integration

Fields of Study

  • Engineering

Readers

  • Aerospace Test and Evaluation
  • Regression Analysis.
  • Thin Film Deposition Science.