Dielectric Analysis of the Cure of Thermosetting Epoxy/Amine Systems.

Abstract

The conductivity of seven epoxy resins of varying molecular weights were studied (without hardener) as a function of temperature. In addition, a low molecular weight resin was cured isothermally with an aromatic amine hardener and the conductivity was measured as a function of cure time. The conductivities of the resins without hardener obey a Williams-Landel-Ferry relation, and by incorporating a cure-dependent glass transition temperature into this relation, the observed behavior of the resin-plus-hardener system can be modeled.

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Document Details

Document Type
Technical Report
Publication Date
Aug 18, 1986
Accession Number
ADA171274

Entities

People

  • Norman F. Sheppard Jr.
  • Stephen D. Senturia

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • C4I

DTIC Thesaurus Topics

  • Charge Carriers
  • Conductivity
  • Conversion
  • Curing
  • Curing Agents
  • Dielectric Properties
  • Electrical Engineering
  • Epoxy Resins
  • Equations
  • Glass
  • Glass Transition Temperature
  • Military Research
  • Molecular Weight
  • Resins
  • Semiconductors
  • Transition Temperature
  • United States

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Surface Coatings Technology.