New Ultra-Low Permittivity Composites for Use in Ceramic Packaging of Ga:As Integrated Circuits

Abstract

This report documents work performed over the second year of a three- year joint program between the Materials Research Laboratory at Penn State University and Interamics in La Jolla, CA, to develop new ultra-low permittivity composite dielectrics for use in the ceramic packaging of Ga:As integrated circuits. The period covered by this report is August 1, 1985, to July 31, 1986, and the work was supported by ONR Contract No. N00014-84-K-00721 under DARPA order No. 5157. Topics for study during this year at Penn State have been: 1. Sol-gel processing of si02 films and monoliths. 2. Sputter deposited Si02 film structures. 3. Microporous glass structures. 4. Macro-Defect-Free (MDF) cements.

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Document Details

Document Type
Technical Report
Publication Date
Aug 11, 1986
Accession Number
ADA171705

Entities

People

  • Leslie Eric Cross

Organizations

  • Pennsylvania State University

Tags

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemistry
  • Composite Materials
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Fabrication
  • Integrated Circuits
  • Mass Spectrometry
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Physical Properties
  • Semiconductor Devices
  • Thermal Conductivity
  • Very Large Scale Integration

Fields of Study

  • Materials science

Readers

  • Surface Coatings Technology.
  • Technical Research and Report Writing.
  • Thin Film Deposition Science.