A Report Summary of Activities and Results Related to Adhesive Bonding,
Abstract
The program at the California Institute of Technology on adhesive bonding has several objectives which are related to improve the design/analysis capability for the durable application of bonded joints. The more specific intention is to develop analytical methods which establish or improve the predictive power for computing stresses and failure in bonded joints. The topics under consideration are primarily mechanics oriented, but draw on the interdisciplinary fields of polymer mechanics. Under the latter discipline we understand those topics that deal with the molecular structure and with polymer chain mechanics from a microscopic basic physical properties of the bonded-joint components and their interaction. The disciplines under study are categorized most easily according to the size scale of the phenomena; these are listed first and then explained in some detail in terms results obtained and prospects: 1. Effect of carrier cloth on adhesive modulus; 2. Analytical material representation in terms of smooth relaxation or retardation spectra; 3. Thermo-mechanical behavior of adhesive materials; 4. Nonlinearly viscoelastic adhesive behavior; 5. Bond enhancement via ion bombardment.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 10, 1986
- Accession Number
- ADA173208
Entities
People
- W. G. Knauss
Organizations
- California Institute of Technology