Preparation and Adhesion of Ultra Thin Polyimide Films on Polycrystalline Silver.

Abstract

4.4-Oxydianiline (ODA) and 1,2,3,5 Benzenetetracarboxylic Anhydride (PMDA) from the vapor phase were deposited onto a polycrystalline silver substrate and followed the polymerization of the two components to form ultra-thin polyimide films (d approx. 11A) by X-ray photoelectron spectroscopy. Both PMDA and ODA chemisorb on the clean surface under partial fragmentation. Co-deposition of ODA and PMDA followed by heating of the substrate led to formation of thermally stable (T < 450C) polyimide films. Our data indicate that adhesion of the polyimide film to the surface involves chemical bonding to fragmented PMDA and/or ODA chemisorbed on the substrate. Our experiments show that polyimide films can be prepared sufficiently thin to allow the application of surface sensitive techniques to probe the substrate-polymer interface and to study the basic physics and chemistry of adhesion.

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Document Details

Document Type
Technical Report
Publication Date
Jun 07, 1986
Accession Number
ADA174023

Entities

People

  • M. Grunze
  • R. N. Lamb

Organizations

  • University of Maine

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Chemical Properties
  • Chemical Reactions
  • Chemistry
  • Dissociation
  • Energy
  • Energy Bands
  • Films
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Metals
  • Military Research
  • Spectra
  • United States
  • Vapor Deposition

Readers

  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene