Characterization of Ultra Thin Polyimide Films (d approx. 11A) Formed by Vapour Deposition of 4,4-Oxidianiline and 1,2,3,5 Benzenetetracarboxylic Anhydride.

Abstract

The popularity of polyimides in, for example, packaging and dielectrics in electronic devices, stem from their favorable physical properties (eg. thermal stability, moisture resistance) and their ease of application (spin coating). The formation of ultra thin polymer films on a bulk metal surface has been achieved by the controlled vapour deposition of the polymer precursors (4,4-Oxydianiline(ODA) and 1,2,3,5 Benezenetetracarboxylic Anhydride (PMDA)) on a polycrystalline silver substrate and the subsequent thermal polymerization of the codeposited layer. The production of sufficiently thin organic films made the substrate-film interfacial region suitable for analysis using X-ray photoelectrion spectroscopy (XPS).

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Document Details

Document Type
Technical Report
Publication Date
Jun 07, 1986
Accession Number
ADA174266

Entities

People

  • M. Grunze
  • R. N. Lamb

Organizations

  • University of Maine

Tags

Communities of Interest

  • C4I
  • Ground and Sea Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Anhydrides
  • Bulk Materials
  • Chemistry
  • Civil Engineering
  • Films
  • Materials
  • Materials Science
  • Military Research
  • Physical Properties
  • Polymeric Films
  • Polymers
  • Quantum Properties
  • Spectra
  • Substrates
  • Thermal Stability
  • United States
  • Universities

Readers

  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene