Design and Fabrication of Submicron Magnetic Bubble Device Technology.
Abstract
Work was carried out on high density (16 to 64 Mbit/sq cm) magnetic bubble device technology. Highlights of the research include the successful fabrication of silicon MOSFETS on bubble garnet substrates and the development of ion implanted bubble devices utilizing 0.5um bubbles in garnets with isotropic magnetostriction. In addition, studies of the effects of ion implantation on garnet lead to improved fabrication techniques for the 0.5um devices. Chips utilizing 1um bubbles were demonstrated to have about 9% bias field margins at 50 0e drive, and a numerical model was developed to model current accessed ion implanted devices. Keywords Include: Bubble Memory, Ion Implantation, Garnet, Silicon-on-Insulator, and Silicon-on-Garnet.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 31, 1986
- Accession Number
- ADA174621
Entities
People
- C. L. Bauer
- D. W. Greve
- M. Alex
- M. H. Kryder
- R. O. Campbell
Organizations
- Carnegie Mellon University