On Thermal and Thermal Stress Analyses in Substrates during Coating Deposition.

Abstract

Thermal deflection of a cantilever substrate and a circular wafer during and after thin film deposition is analyzed. Simple and accurate expressions for the substrate temperature are obtained under the assumption of constant heat flux at the front surface and heat dissipation according to Newton's law at the rear surface during deposition and heat dissipation at both surfaces after deposition. The solution is then applied to extract, from published measured total deflection-history data, the deflection history of the substrate due to intrinsic stress only. Keywords: Thin-film coatings; Thermal distribution; Thermal stresses; Thermal analysis.

Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1986
Accession Number
ADA176190

Entities

People

  • D. J. Chang
  • P. H. Li
  • R. Muki

Organizations

  • The Aerospace Corporation

Tags

DTIC Thesaurus Topics

  • Coatings
  • Deflection
  • Dissipation
  • Films
  • Heat Energy
  • Heat Flux
  • Stress Analysis
  • Stresses
  • Substrates
  • Thermal Analysis
  • Thermal Stresses
  • Thin Films

Readers

  • Combustion and Flow Dynamics.
  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)
  • Thin Film Deposition Science.