Ultrasonic Cure Characterization of Epoxy Resins: Constitutive Modeling,
Abstract
The use of ultrasound to monitor the cure of epoxy resins have been reported in the lit erature. It has been observed that the speed of the ultrasonic wave increases as the resin cures while the attenuation first increases and then decreases. These changes have been qualitatively explained in terms of the changes in viscosity. In order to use ultrasonic technique to characterize property changes during cure, quantitative relationships between changes in the wave speed and attenuation on the one hand and changes in the elastic modulus and viscosity on the other must be established. Ultrasonic data available in the literature were converted to complex moduli within the framework of the theory of wave propagation in linear viscoelastic materials. Simple spring-dashpot combinations were then used to develop a constitutive model, and the pertinent elastic moduli and viscosities were obtained from the complex moduli. The elastic moduli inferred from the complex moduli were found to agree well with the values measured by mechanical testing.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1986
- Accession Number
- ADA176661
Entities
People
- E. J. Tuegel
- H. T. Hahn
Organizations
- Washington University in St. Louis