Reproducibility of Electromigration Measurements

Abstract

The reproducibility of median time to failure (t sub 50) measurements was determined in an interlaboratory experiment in which 11 laboratories took part with a reference laboratory. Each laboratory used a method of its choosing to test equivalent samples under the same conditions of current density and oven temperature. The between laboratory reproducibility of t sub 50 measurements normalized to one metallization temperature was dependent on current-density stress: at 1.0 MA/sq cm it was within 15%, while at 2.5 MA/sq cm it was generally within 50%. The primary source for variability is in estimating the temperature rise of the test metallization due to joule heating. Recommendations are given for the design and test of electromigration test structures to improve the reproducibility of t sub 50 measurements.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1987
Accession Number
ADA177369

Entities

People

  • Harry A. Schafft
  • John D. Shott
  • John Mandel
  • Tammy C. Staton

Organizations

  • Stanford University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Agreements
  • Coefficients
  • Current Density
  • Detectors
  • Dissipation
  • Electrical Measurement
  • Energy
  • Heat Of Activation
  • Heat Sinks
  • Information Science
  • Measurement
  • Reproducibility
  • Resistance
  • Standards
  • Stress Tests
  • Temperature Coefficients
  • Test Methods

Readers

  • Regression Analysis.
  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.