Monitoring the Cure of a Composite Matrix Resin with Microdielectrometry.

Abstract

Solvent free resin was prepared from a MY720-DDS prepreg solution by evaporation in a vacuum oven. This material was cured under vacuum by a ramp-hold-ramp to cure temperature cycle and the temperature and dielectric loss factor at 5 frequencies were measured every four minutes for the duration of the cure cycle. At selected times during the cure, small samples of the reacting mixture are removed and quenched and subsequently analyzed for Tg. At frequencies of 1 and 10 Hz, the ionic conductivity dominates the loss factor and the logarithmic derivative of the loss factor with respect to time equals the logarithmic derivative of the conductivity with respect to time. This derivative is then related to the derivative of Tg with respect to time by a WLF equation. Keywords: Conductivity, Thermosetting polymers, Williams-Landel-Ferry equation, Glass transition temperature, Epoxy resins, Amine hardener, Network structure, Microdielectrometry, Differential scanning calorimetry, Loss factor.

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Document Details

Document Type
Technical Report
Publication Date
Nov 15, 1986
Accession Number
ADA177490

Entities

People

  • Stephen D. Senturia
  • Wayne W. Bidstrup

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Blood Coagulation Factors
  • Chambers
  • Composite Materials
  • Conductivity
  • Curing
  • Dielectric Permittivity
  • Dielectric Properties
  • Electric Fields
  • Engineering
  • Epoxy Resins
  • Equations
  • Glass
  • Glass Transition Temperature
  • Materials
  • Resins
  • Transition Temperature
  • Transitions

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Mathematics or Statistics
  • Reinforced Composite Materials