Microfabricated Structures for the Measurement of Adhesion and Mechanical Properties of Polymer Films.

Abstract

Microfabricated test structures for the in-situ measurement of adhesion of thin films have been described. Young's modulus and residual tensile stress are determined from pre-peel measurement of the load-deflection behavior of suspended membranes. On systems of weak adhesion, a blister test using suspended membranes has been carried out. For systems of good adhesion, an island test structure has been developed allowing even thin films to be tested. Mechanical models for all three structures are described. Keywords: Polymer, Polyimide, Mechanical properties, Adhesion, Film, Microfabrication, Stress, Modulus, Blister test, Critical pressure, Peel.

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Document Details

Document Type
Technical Report
Publication Date
Nov 15, 1986
Accession Number
ADA177586

Entities

People

  • Mark G. Allen
  • Stephen D. Senturia

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Computer Science
  • Engineering
  • Films
  • Massachusetts
  • Materials
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Micro-Machines
  • Microfabrication
  • Military Research
  • Polymeric Films
  • Stresses
  • Tensile Stress
  • Thin Films
  • United States

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Reinforced Composite Materials
  • Thin Film Deposition Science.