Solid-State Threshold Accelerometer Chip.

Abstract

Micromechanical cantilever beam structures having a maximum length of 0.16 in. were designed, fabricated, and tested in six configurations for use as threshold acceleration sensors for projectile fuzes. Their small size and ability to be produced using monolithic fabrication techniques commonly used to make integrated circuits provides the possibility of incorporating multiswitch arrays into a single die surface area one hundredth of a square inch. Design, fabrication, and test details are provided for two triple-beam arrays of cantilever structures made from 3-micrometer-thick silicon dioxide. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Mar 28, 1987
Accession Number
ADA180112

Entities

People

  • Al Meyer
  • Lou Faraco

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Cantilever Beams
  • Circuits
  • Conductive Polymers
  • Electrical Engineering
  • Electronics
  • Fabrication
  • Instrumentation
  • Integrated Circuits
  • Materials
  • Measurement
  • Modal Analysis
  • Modulus Of Elasticity
  • Oxides
  • Projectiles
  • Resonant Frequency
  • Silicon Dioxide
  • Stiffness

Fields of Study

  • Physics

Readers

  • Electrical Engineering
  • Materials Science (Mechanical Engineering).
  • Mathematics or Statistics