VLSI/VHSIC (Very Large Scale Integrated/Very High Speed Integrated Circuits) Package Test Development.

Abstract

The test methods of MIL-STD-883 were reviewed to assess their appropriateness in view of the new package styles and materials being used for BLSI/VHSIC devices. Experiments were performed to judge the effectiveness of existing tests. Changes to existing tests are proposed where deemed necessary and new tests are developed where no existing method adequately assess new technology devices. Proposed changes and/or new package tests evaluate: solderability of leads; pin grid lead pull strength; leadless chip carrier bond strength; die attach bond analysis; characteristic impedance, capacitance, and delay time of high speed signals; crosstalk; and flip-chip pull strength. Keywords include: Very Large Scale Integrated and Very High Speed Integrated Circuits (VLSI/VHSIC), Hugh I/O Count Packages, and Microcircuit Packages.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1986
Accession Number
ADA182360

Entities

People

  • Kay E. Clark

Organizations

  • Raytheon Missiles & Defense

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Acoustic Waves
  • Aluminum Oxides
  • Crystal Structure
  • Detectors
  • Electrical Properties
  • Failure Mode And Effect Analysis
  • Flip Chips
  • Integrated Circuits
  • Materials
  • Measurement
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation
  • Test Equipment
  • Test Methods
  • Transmission Lines
  • Very Large Scale Integration

Fields of Study

  • Engineering

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems